FPGA/IC領域術語表

Chip Architecture芯片架構

ADC: Analog to Digital Converter 模數轉換器

AES: Advanced encryption standard 高級加密標準

Adder: Circuit to add two numbers 將兩個數字相加的電路

ALU: Arithmetic logic unit 算術邏輯單元

Amdahl's Law: Amdahl's law of diminishing returns for speeding up fixed workloads 阿姆達爾定律-通過優化系統的單個部分獲得的整體性能改進受到實際使用改進部分的時間分數的限制

Arbiter: Arbitrates between competing requesters 仲裁器-在競爭請求者之間進行仲裁

ASIC: Application specific integrated circuit.專用集成電路。

Audio codec: Device/program that compresses/decompresses digital audio 音頻編解碼器-壓縮/解壓縮數字音頻的設備/程序

Boolean algebra: Algebra in which variables are either true or false 布爾代數-變量為真或假的代數

BTB: Branch target buffer 分支目標緩沖區

Cache: Local storage of program and/or data for future use. 程序和/或數據的本地存儲以供將來使用。

Cache coherence: Consistency of shared data that is stored in multiple local caches.存儲在多個本地緩存中的共享數據的一致性。

CAM: Content addressable memory 內容可尋址存儲器

CISC: Complex instruction set computing 復雜指令集

Coprocessor: A processor used to supplement operations of a primary (host) processor.協處理器-用于補充主處理器操作的處理器。

CPI: Cycles per instruction 每條指令的周期

CPU: Central processing unit 中央處理器

CRC: Cyclic redundancy check 循環冗余校驗

CSA: Carry save adder 進位保存加法器

DAC: Digital to Analog Converter 數模轉換器

Distributed Computing: Computer with components working towards common goal with without strict coupling.分布式計算-具有朝著共同目標工作的組件的計算機，沒有嚴格的耦合。

DLL: Delay locked loop 延遲鎖定環(DLL) 是一種類似于鎖相環(PLL) 的數字電路

DMA: Direct memory access 直接內存訪問

DDR Double data rate 雙倍數據速率

DDS: Direct digital synthesis 直接數字合成

DSM: Distributed shared memory 分布式共享內存

DSP: Digital signal processor 數字信號處理器

ECC: Error correcting code 糾錯碼

Ethernet: Family of standard network technologies 標準網絡技術系列

Fault Tolerance: The ability of a system to keep operating in the event of failure of one of its components. 容錯-系統在其組件之一發生故障的情況下保持運行的能力。

FRAM: Non-volatile RAM based on ferroelectric layer.基于鐵電層的非易失性 RAM。

FPGA: Field-programmable gate array is a chip that can be reprogrammed "in the field". 現場可編程門陣列

FIFO: First in first out buffer 先進先出緩沖區

GPU: Integrated circuit for accelerating the creation of graphics on a display. 圖形處理單元

DRAM: Dynamic random-access semiconductor memory 動態隨機存取半導體存儲器

Flash: Non-volatile semiconductor memory 非易失性半導體存儲器

FFT: Fast Fourier transform 快速傅里葉變換

FPU: Floating point unit 浮點單元

GPIO: General purpose input output, controllable at run time 通用輸入輸出，運行時可控

Gray code: Binary system where successive values differ by one bit 格雷碼：連續值相差一位的二進制系統

HBM: High bandwidth memory 高帶寬內存

I2C: Multi-master 2 wire bus 多主機 2 線總線

LAN: Local area network 局域網

LFSR: Linear feedback shift register 線性反饋移位寄存器

LSB: Least significant bit 最低有效位

[LUT] (https://en.wikipedia.org/wiki/Lookup_table): An array that replaces runtime computation with a simpler array indexing operation 查找表(LUT) 是一個數組，它用更簡單的數組索引操作代替運行時計算。

LVDS: Low-voltage differential signaling (also TIA/EIA-644) 低壓差分信號（也是 TIA/EIA-644）

MII: Media independent interface for PHY chips PHY芯片的媒體獨立接口

MIMD: Multiple instructions multiple data architecture 多指令多數據架構

MMU: Memory management unit 內存管理單元

MSB: Most significant bit 最高有效位

MUX: Multiplexer 多路復用器

Multiplier: Binary multiplier 二進制乘數

NCO: Numerically controlled oscillator 數控振蕩器

NOC: Network on a chip 片上網絡

Parallel Computing: A type of computation where many operations are carried out simultaneously. 并行計算

PCM: Phase change memory 相變存儲器

PCIe: High Speed serial computer expansion bus 高速串行計算機擴展總線

PIC: Programmable interrupt controller 可編程中斷控制器

Priority Encoder: A circuit or algorithm that compresses multiple binary inputs into a smaller number of outputs 優先級編碼器-將多個二進制輸入壓縮成較少數量輸出的電路或算法

PLL: Phase locked loop 鎖相環

PWM: Pulse width modulation脈沖寬度調制

Q: Q fixed point number formatQ 定點數格式

RAID: Redundant array of disks 冗余磁盤陣列

Reconfigurable Computing: Collection of customizable datapaths connected together by a fabric 可重構計算-通過結構連接在一起的可定制數據路徑的集合

RISC: Reduced instruction set computing 精簡指令集計算

ROM: Read only memory (denser than RAM) 只讀存儲器（比 RAM 更密集）

SBC: Single board computers 單板計算機

SDR: Software defined radio 軟件定義無線電

SERDES: Serializer/deserializer 串行器/解串器

Shift Register: Set of registers that shifts bits one position at a time 一次移位一個位置的一組寄存器

SIMD: Single instruction multiple data 單指令多數據

Schmitt Trigger: Comparator circuit with hysteresis 施密特觸發器-具有遲滯的比較器電路

SPI: Synchronous 4 wire master/slave interface 同步4線主/從接口

SRAM: Static random access semiconductor memory 靜態隨機存取半導體存儲器

TLB: Translation lookaside buffer 翻譯后備緩沖區

UART: Asynchronous 2 wire point to point interface 異步2線點對點接口

USB: 2 wire point to point 5 V interface 2線點對點5V接口

Video codec: Device/program that compresses/decompresses digital video 視頻編解碼器-壓縮/解壓縮數字視頻的設備/程序

Virtual Memory: The automatic mapping of virtual program addresses to physical addresses 虛擬內存-虛擬程序地址到物理地址的自動映射

VLIW: Very long instruction level parallelism 長的指令級并行性

WAN: Wide area network 廣域網

WIFI: Wireless local area network 無線局域網

8b10b: Code that maps 8-bits to 10bit DC balanced symbols 將 8 位映射到 10 位 DC 平衡符號的代碼

Chip Design芯片設計

Antenna effect: Plasma induced gate oxide damage that can occur during semiconductor processing. 天線效應-在半導體加工過程中可能發生的等離子引起的柵極氧化物損壞。

Asynchronous logic: Logic not governed by a clock circuit or global clock. 異步邏輯-不受時鐘電路或全局時鐘控制的邏輯。

ATPG: Automatic test pattern generation 自動測試模式生成

BIST: Built in Self Test 內置自檢

Chip: A set of electronic circuits on one small plate ("chip") of semiconductor material, normally silicon. 芯片

Clock domain crossing: Traversal of signal in synchronous digital ssytem from one clock domain to another.時鐘域交叉-同步數字系統中的信號從一個時鐘域到另一個時鐘域的遍歷。

Clock gating: Technique whereby clock in synchronous logic is shut off when idle.門控時鐘-同步邏輯中的時鐘在空閑時關閉的技術。

CMOS: Complimentary metal-oxide semiconductor 互補金屬氧化物半導體

Cross talk: The coupling of nearby signals on a chip, usually through capacitive coupling. 串擾

CTS: Clock tree synthesis 時鐘樹合成

Domino logic: Fast clocked logic with reduced capacitive load 具有減少容性負載的快速時鐘邏輯

DEF: Design Exchange Format for layout 布局的設計交換格式

DFM: Extended DRC rules specifying how to make a high yielding design. 擴展的 DRC 規則，指定如何進行高產量設計。

DFT: Design for test可測試性設計或可測試性設計

Die: Small block of semiconductor material that can be cut ("diced") from a silicon wafer.可以從硅晶片上切割（“切塊”）的小塊半導體材料

DRC: Design Rule Constraints specifying manufacturing constraints. 指定制造約束的設計規則約束

DV: Design verification is the process of verifying that the logic design conforms to specification. 設計驗證是驗證邏輯設計是否符合規范的過程

ECO: Engineering change order 工程變更單

EDA: Electronic Design Automation tools used to enhance chip design productivity. 用于提高芯片設計生產力的電子設計自動化工具

EDA companies: List of EDA companies EDA 公司

Electromigration: Transport of material caused by the gradual movement of the ions in a conductor. 由導體中的離子逐漸運動引起的物質傳輸。

EMI: Electromagnetic interference. 電磁干擾

ESD: Electrostatic discharge is the sudden flow of electricity between two electrically charged objects. 靜電放電是兩個帶電物體之間的突然電流流動

Fabless: The design and sale of semiconductor devices while outsourcing the manufacturing to 3rd party. 半導體設備的設計和銷售，同時將制造外包給第三方-無晶圓制造是硬件設備和半導體芯片的設計和銷售，同時將其制造（或晶圓廠）外包給稱為半導體代工廠的專業制造商.

FEOL: Front end of line processing. Includes all chip processing up to but not including metal interconnect layers. 生產線前端處理。包括所有芯片處理，但不包括金屬互連層。

Flip-flop: A clocked circuit that has two stable states and can be used to store state information. 觸發器

Foundry: Semiconductor company offering manufacturing services. 提供制造服務的半導體公司

Full custom design: Design methodology involving layout and interconnection of individual transistors. 完全定制設計-涉及各個晶體管的布局和互連的設計方法

GDSII: Binary format of design database sent to foundry. 發送制造廠的設計數據庫的二進制格式

HDL: Specialized hardware description lanaguage for describing electronic circuits. 用于描述電子電路的專用硬件描述語言

Hold time: Minimum time synchronous input should hold steady after clock event. 時鐘事件后同步輸入應保持穩定的最短時間

IP: Semiconductor reusable design blocks containing author's Intellectual Property. 含作者知識產權的半導體可重復使用設計塊

IP Vendors: List of commercial semiconductor IP vendors. IP 供應商

ISI: Intersymbol interference 符號間干擾( ISI ) 是一種信號失真形式，其中一個符號會干擾后續符號

Jitter: Deviation from perfect periodicity. 偏離完美的周期性

Latchup: Short circuit due to creation of a low-impedance path between the power supply rails of a circuit. 閂鎖-由于在電路的電源軌之間創建低阻抗路徑而引起的短路

Layout: Physical representation of an integrated circuit. 布局-集成電路的物理表示

LEF: Standard Cell Library Exchange Format layout.標準單元庫交換格式布局。

Logical Effort: Technique used to normalize (and optimize) digital circuits speed paths. Logical Effort是Ivan Sutherland和Bob Sproull在 1991 年創造的一個術語，是一種用于估計CMOS電路延遲的簡單技術

LVS: Layout Versus Schematic software checks that the layout is identical to the netlist.LVS : Layout Versus Schematic 軟件檢查布局是否與網表相同。

Mask Works: Copyright law dedicated to 2D and 3D integrated circuit "layouts". “掩模工作”-專門針對 2D 和 3D 集成電路“布局”的版權法。

Mealy machine: A finite state machine whose outputs depend on current state and the current inputs. 一種有限狀態機，其輸出取決于當前狀態和當前輸入。

Metastability: Ability of a digital electronic system to persist for an unbounded time in an unstable equilibrium. 數字電子系統在不穩定平衡中持續無限時間的能力。

MLS: Packaging and handling precautions for some semiconductors. 濕氣敏感度級別與某些半導體的包裝和處理注意事項有關。MSL 是針對濕度敏感設備可暴露于室內環境條件（1 級為 30 °C/85%RH；所有其他級別為 30 °C/60%RH）的時間段 的電子標準。

Moore Machine: Finite state machine whose outputs depend only on its current state.Moore型有限狀態機，其輸出僅取決于其當前狀態。

Moore's Law: Observation by Moore that the number of transistors in an IC doubles approximately every two years. 摩爾定律-摩爾觀察到，IC 中的晶體管數量大約每兩年翻一番。

MOSFET: Metal oxide field effect transistor. 金屬氧化物場效應晶體管。

MOSIS: Foundry service project offering MPWs and low volume manufacturing. 提供MPW和小批量制造的鑄造服務項目。

MPW: Multi-project wafer service that integrates multiple designs on one reticle (aka "shuttle"). 多項目芯片( MPC ) 和多項目晶圓( MPW ) 半導體制造安排允許客戶在多個設計或項目之間共享掩模和微電子 晶圓制造成本

MTBF: Mean time between failures. 平均故障間隔時間。

Multi-threshold CMOS: CMOS technology with multiple transistor types with different threshold voltages. 多閾值 CMOS：具有不同閾值電壓的多種晶體管類型的 CMOS 技術。

Optical proximity correction: Technique used to compensate for semiconductor diffraction/process effects. 光學鄰近校正-用于補償半導體衍射/工藝效應的技術。

Pass Transistor Logic: Logic that connects input to non-gate terminal of mosfet transistor. 將輸入連接到mosfet晶體管的非柵極端子的邏輯

Physical design: Physical design flow ("layout").物理設計流程（“布局”）。

PDK: Process design kits consisting of a minimum set of files needed to design in a specific process. 流程設計工具包，包含在特定流程中進行設計所需的最少文件集

Power gating: Technique used to reduce leakage/standby power by shutting of the supply to the circuit. 電源門控：用于通過關閉電路電源來減少泄漏/待機功率的技術

P&R: Automated Place and Route of a circuit using an EDA tool. 使用 EDA 工具自動布局和布線電路

PVT Corners: Represents the extreme process, voltage, temperature that could occur in a given semiconductor process. 表示給定半導體工藝中可能出現的極端工藝、電壓、溫度

Radiation Hardening: Act of making devices resistant to damage caused by ionizing radiation. 輻射硬化是使電子元件和電路能夠抵抗由高水平電離輻射（粒子輻射和高能電磁輻射）引起的損壞或故障的過程

RTL: Design abstraction for digital circuit design. 寄存器傳輸級( RTL ) 是一種設計抽象，它根據硬件寄存器之間的數字信號（數據）流以及對這些信號執行 的邏輯操作對同步 數字電路進行建模

Setup time: Minimum time synchronous input should be ready before clock event. 建立時間-最小時間同步輸入應在時鐘事件之前準備好

SEU: Change of state caused by one single ionizing particle (ions, electrons, photons...). 由單個電離粒子（離子、電子、光子......）引起的狀態變化

Signoff: The final approval that the design is ready to be sent to foundry for manufacturing. signoff（也寫為sign-off ）檢查是設計在流片之前必須通過的一系列驗證步驟的總稱

SOC: System On Chip 片上系統

Spice: Open source analog electronic circuit simulator. 開源模擬電子電路模擬器

STA: Method of computing the expected timing of a digital circuit without requiring full circuit simulation. 靜態時序分析(STA)

Standard Cell Design: Design process relying on a fixed set of standard cells. 標準單元設計-設計過程依賴于一組固定的標準單元

Subthreshold Leakage: Current between source and drain in MOSFET when transistor is "off". 亞閾值泄漏-晶體管“關閉”時 MOSFET 源極和漏極之間的電流

Synchronous logic: Logic whose state is controlled by a synchronous clock. 同步邏輯

Synthesis: Translation of high level design description (e.g. Verilog) to a netlist format (e.g. standard cell gate level). 綜合-將高級設計描述（例如 Verilog）轉換為網表格式（例如標準單元門級）

SystemC: Set of C++ classes and macros for simulation. Commonly used for high level modeling and testing. 一組用于模擬的 C++ 類和宏。常用于高級建模和測試

Tape-out: Act of sending photomask chip database ("layout") to the manufacturer. 流片：將光掩模芯片數據庫（“布局”）發送給制造商的行為。

TCL: Scripting language used by most of the leading EDA chip design tools. 大多數領先的 EDA 芯片設計工具使用的腳本語言。

Transistor: A semiconductor device used to amplify/switch electronic signals. 晶體管

Verilog: The dominant hardware description language (HDL) for chip design. 用于芯片設計的主要硬件描述語言 (HDL)

VLSI: Very large Integrated Circuit (somewhat outdated term, everything is VLSI today). 大的集成電路（有點過時的術語，今天一切都是 VLSI）

Von Neumann architecture: Computer architecture in which instructions and data are stored in the same memory. 馮諾依曼架構：指令和數據存儲在同一內存中的計算機架構。

Manufacturing制造業

BEOL: Back end of line processing for connecting together devices using metal interconnects. 使用金屬互連將設備連接在一起的生產線后端處理。

Dicing: Act of cutting up wafer into individual dies. 切割-將晶圓切割成單個裸片的行為

FinFet: Non planar, double-gate transistor. 非平面雙柵晶體管

Photo-lithography: Process used in micro-fabrication to pattern parts of a thin film or the bulk of a substrate. 光刻：用于微制造的工藝，用于對薄膜的部分或基板的主體進行圖案化。

Photomasks: Opaque plates with holes or transparencies that allow light to shine through in a defined pattern. 光掩模：帶有孔或透明膠片的不透明板，可讓光線以規定的圖案透過。

Reticle: A set of photomasks used by a stepper to step and print patterns onto a silicon wafer.標線：步進機使用的一組光掩模，用于在硅晶片上步進和打印圖案。

Semiconductor Fabrication: Process used to create the integrated circuits. 半導體制造：用于制造集成電路的工藝。

Silicon: Element (Si), forms the basis of the electronic revolution. 硅：元素 (Si)，構成電子革命的基礎。

Silicon on insulator: Layered silicon–insulator–silicon with reduced parasitic capacitance. 絕緣體上硅：具有降低寄生電容的層狀硅-絕緣體-硅。

Stepper: Machine that passes light through reticle onto the silicon wafer being processed. 步進器：將光通過標線板傳遞到正在處理的硅晶片上的機器。

TSV: Vertical electrical connection (via) passing completely through a silicon wafer or die. 硅通孔( TSV ) 或芯片通孔是完全穿過硅晶片或芯片的垂直電連接(通孔)。

Wafer: Thin slice of semiconductor material used in electronics for the fabrication of integrated circuits. 晶片：用于制造集成電路的電子器件中的半導體材料薄片。

Wafer thinning: Wafer thickness reduction to allow for stacking and high density packaging. 晶圓減薄：晶圓厚度減小以允許堆疊和高密度封裝。

Packaging封裝

3D IC's: The process of stacking integrated circuits and connecting them through TSVs. 通過堆疊硅晶片或裸片并使用例如硅通孔(TSV) 或 Cu-垂直互連

BGA: Ball grid array is a type of surface-mount packaging (a chip carrier) used for integrated circuits. 球柵陣列是一種用于集成電路的表面貼裝封裝（芯片載體）

BGA substrate: A miniaturized PCB that mates the silicon die to BGA pins. 將硅芯片與 BGA 引腳配對的小型化 PCB

Bumping: Placing of bumps on wafer/dies in preparation for package assembly. 凸塊：在晶圓/裸片上放置凸塊，為封裝組裝做準備。

DIMM: Dual in line memory module. 雙列直插內存模塊。

Flip-chip: Method of bonding a silicon die to package using solder bumps. 使用焊料凸點將硅芯片鍵合到封裝上的方法。

IC Assembly: Semiconductor die is encased in a supporting case "package". IC 組裝

Interposer: Electrical interface used to spread a connection to a wider pitch. 用于將連接擴展到更寬間距的電氣接口

Heat sink: A passive heat exchanger. 散熱器-被動式熱交換器。

Heat pipe: Device for efficiently transferring heat between two solid interfaces . 熱管-在兩個固體界面之間有效傳遞熱量的裝置。

KGD: Known Good Die. Dies that have been completely tested at wafer probe. 晶圓測試是半導體器件制造過程中執行的一個步驟。在此步驟中，在將晶圓發送到芯片準備之前執行，晶圓上存在的所有單個集成電路都通過對其應用特殊的測試模式來測試功能缺陷。

Leadframe: Metal structure inside a chip package that carry signals from the die to the outside. 引線框架：芯片封裝內的金屬結構，可將信號從芯片傳送到外部。

POP: Package on Package

SIP: System In Package 系統封裝

SMT: Technique whereby packaged chips are mounted directly onto the PCB surface. 封裝芯片安裝在 PCB 表面上的技術。

Through-hole: TPackage pins inserted in drilled holes and soldered on opposite side of the board. 通孔

Wirebond: Method of bonding a silicon die to a package using wires. 使用導線將硅芯片與封裝結合的方法

WSI: Wafer scale integration 晶圓級集成

Test測試

Arbitrary Waveform Generator: Electronic instrument used to generate arbitrary signal waveforms. 任意波形發生器：用于產生任意信號波形的電子儀器。

ATE: Automatic Test Equipment for testing integrated circuits. 用于測試集成電路的自動測試設備。

Burn-in: Process of screening parts for potential premature life time failures. 老化：篩選零件以發現潛在的過早壽命故障的過程。

DIB: Device Interface Board for interfacing DUT to ATE. Also called DUT board, probe card, load board, PIB. 用于將 DUT 連接到 ATE 的設備接口板。也稱為 DUT 板、探針卡、負載板、PIB。

DMM: Electronic instrument for measuring voltage, current, and resistance. 用于測量電壓、電流和電阻的電子儀器。

DUT: Device under test 被測設備

FIB: Focused ion beam 聚焦離子束

JTAG: Industry standard for verifying and testing/debugging printed circuit boards after manufacturing. 制造后驗證和測試/調試印刷電路板的行業標準。

Logic Analyzer: Electronic instrument for capturing multiple digital signal from a system. 邏輯分析儀：用于從系統中捕獲多個數字信號的電子儀器。

MCM: Multi-chip Module 多芯片模塊

Oscilloscope: Electronic instrument for tracking the change of an electrical signal over time. 示波器：跟蹤電信號隨時間變化的電子儀器。

Probe Card: A direct interface between electronic test systems and a semiconductor wafer. 探針卡：電子測試系統和半導體晶片之間的直接接口。

SEM: Scanning electron microscope 掃描電子顯微鏡

Shmoo Plot: An ASCII plot of a component response over a range of conditions. Shmoo 圖：在一系列條件下組件響應的 ASCII 圖。

Spectrum Analyzer: Electronic instrument for measuring the power of the spectrum of an unknown signal. 頻譜分析儀：用于測量未知信號頻譜功率的電子儀器。

審核編輯 ：李倩