近期，2023中國(guó)·南沙國(guó)際集成電路產(chǎn)業(yè)論壇在廣州盛大召開(kāi)。作為國(guó)內(nèi)領(lǐng)先的系統(tǒng)級(jí)驗(yàn)證EDA解決方案提供商，芯華章科技應(yīng)邀出席“汽車芯片分論壇”，共同探討汽車芯片產(chǎn)業(yè)的新機(jī)遇。芯華章科技汽車電子事業(yè)部首席算法科學(xué)家張磊博士受邀發(fā)表《場(chǎng)景+芯片仿真賦能個(gè)性化汽車芯片》的主題演講，分享基于場(chǎng)景的系統(tǒng)級(jí)仿真對(duì)于主機(jī)廠構(gòu)建自主可控“芯”生態(tài)的廣闊應(yīng)用場(chǎng)景。

Recently, the 2023 China·Nansha International Integrated Circuit Industry Forum was grandlyheld in Guangzhou. As a leading provider of system-level verification EDAsolutions in China, X-EPIC was invited to attend the "Automotive Chip Sub-Forum" todiscuss new opportunities in the automotive chip industry. Dr. Zhang Lei, ChiefAlgorithm Scientist of X-EPIC Automotive Electronics Division, was invitedto deliver a keynote speech on "Scene + Chip Simulation EmpoweringPersonalized Automotive Chips", sharing the importance of scenario-basedsystem-level simulation for OEMs to build an independent and controllable"core" ecology broad applications.

張磊博士簡(jiǎn)介

About Dr. Zhang Lei

中科院計(jì)算所工學(xué)博士學(xué)位

武漢大學(xué)數(shù)學(xué)系本科

前SAS中國(guó)區(qū)首席科學(xué)家

TeraData&IBM近二十年算法和數(shù)據(jù)挖掘經(jīng)驗(yàn)

With the evolution of the New Four Modernizations of the automobile industry, in the second half of theintelligentization，both original equipmentmanufacturers (OEMs) and their industry suppliers have recognized that thefunctionality and user experience of products rely not only on softwaredefinition but also on chip definition. This support from chip definition isessential to provide users with solutions and products that offer highercost-effectiveness while meeting performance and safety requirements.

June 10, 2021, X-EPIC officially released "EDA 2.0 White Paper"

芯華章科技董事長(zhǎng)兼CEO王禮賓：

智能化的EDA 2.0時(shí)代，會(huì)使設(shè)計(jì)芯片像開(kāi)發(fā)程序那樣簡(jiǎn)單，制造芯片像搭積木那樣靈活，這個(gè)未來(lái)并不遙遠(yuǎn)，技術(shù)已經(jīng)在路上，芯華章有信心讓EDA 2.0誕生在中國(guó)，誕生在離未來(lái)最近的地方。

• 用戶能夠針對(duì)不同的應(yīng)用場(chǎng)景，來(lái)預(yù)判車輛在實(shí)際使用過(guò)程中出現(xiàn)的風(fēng)險(xiǎn)；

• 實(shí)現(xiàn)軟硬件的開(kāi)發(fā)解耦和前置，幫助主機(jī)廠縮短研發(fā)周期；

• 降低學(xué)習(xí)門(mén)檻，豐富開(kāi)發(fā)工具的同時(shí)優(yōu)化硬件設(shè)計(jì)；

• 更快進(jìn)階到個(gè)性化定義EEA系統(tǒng)，縮短產(chǎn)品上市時(shí)間，在激烈的市場(chǎng)競(jìng)爭(zhēng)中贏得先機(jī)

Deeply cultivating in the automotiveelectronics industry is the practice and breakthrough of X-EPIC's EDA 2.0. InX-EPIC's car simulation solution, with the help of the self-developedhigh-performance emulation system HuaEmu E1:

• Users can predict the risks of vehicles in actual use for differentscenarios.

• Decouple of software and hardware development from early on, helpOEMs shrink the R&D cycle.

• Flatten the learning curve, enrich the development tools andoptimize the hardware design.

• Advance to the customized definition of the EEA system, shorten thetime to market, and take the leading position in new market competition.

• 在車規(guī)芯片的應(yīng)用、測(cè)試過(guò)程當(dāng)中，需要與搭載的軟件提前進(jìn)行配合，才能夠降低芯片在整車應(yīng)用過(guò)程中的風(fēng)險(xiǎn)，確保低故障的同時(shí)，又能夠讓芯片的性能真正的發(fā)揮。

• 一款優(yōu)秀的場(chǎng)景和芯片仿真驗(yàn)證工具，可以幫助解決時(shí)間、人才、工具等三方面的挑戰(zhàn)，更快地進(jìn)行定制化芯片的研發(fā)，降低開(kāi)發(fā)人才門(mén)檻，縮短開(kāi)發(fā)周期，降低各項(xiàng)風(fēng)險(xiǎn)。

• 芯片和應(yīng)用軟件的協(xié)同開(kāi)發(fā)是未來(lái)汽車領(lǐng)域產(chǎn)品差異化及提升用戶體驗(yàn)的關(guān)鍵點(diǎn)之一，借助強(qiáng)大的仿真、定義、驗(yàn)證工具，能夠幫助產(chǎn)品實(shí)現(xiàn)更好的差異化，從而為用戶提供更高性價(jià)比的產(chǎn)品。

At present, X-EPIC's car simulationsolution has taken the lead in making breakthrough attempts in domestic headOEMs and Tier1 solutions.Kang Fei, Deputy Chief Engineer andDirector of Architecture and Vehicle Integration Department at Zhiji AutomotiveResearch and Development Center says:

• In the application and testing process of automotive-grade, it isnecessary to coordinate with the embedded software in advance in order toreduce risks during the chip's integration into the vehicle system. Thisensures both low failure rates and the optimal performance of the chip.
• An excellent scenario and chip simulation verification tool can helpaddress challenges in terms of time, talent, and tools. It enables fasterdevelopment of customized chips, reduces the talent threshold for development,shortens the development cycle, and mitigates various risks.
• The collaborative development of chips and application software isone of the key factors for product differentiation and improving userexperience in the future automotive industry. With powerful simulation,definition, and verification tools, products can achieve betterdifferentiation, thus providing us with higher cost-effective solutions.

X-EPIC's advanced system-level scenariosimulation platform and collaborative verification platform, help automotiveelectronics accelerate the "core" iteration of the next-generationelectrical and electronic architecture, empowering customers to create an"SoC" ecosystem and harness the full potential of "SoC"technology.