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66AK2G12 多核 DSP+ARM KeyStone II 片上系統(tǒng) (SoC)

數(shù)據(jù):

描述

66AK2G1x是基于TI經(jīng)過現(xiàn)場驗證的Keystone II(KS2)架構(gòu)的異構(gòu)多核片上系統(tǒng)(SoC)器件系列。這些器件適用于需要DSP和ARM性能的應(yīng)用,集成了高速外設(shè)和存儲器接口,網(wǎng)絡(luò)和加密功能的硬件加速以及高級操作系統(tǒng)(HLOS)支持。

類似對于現(xiàn)有的基于KS2的SoC器件,66AK2G1x使DSP和ARM內(nèi)核能夠控制系統(tǒng)中的所有存儲器和外設(shè)。這種架構(gòu)有助于實現(xiàn)最大的軟件靈活性,可以實現(xiàn)以DSP或ARM為中心的系統(tǒng)設(shè)計。

66AK2G1x通過在處理器內(nèi)核,共享內(nèi)存,模塊中的嵌入式內(nèi)存和外部存儲器接口中廣泛實施糾錯碼(ECC),顯著提高了器件的可靠性。對軟錯誤率(SER)和通電時(POH)的全面分析表明,指定的66AK2G1x部件滿足廣泛的工業(yè)和汽車要求。

伴隨著新的處理器SDK,66AK2G1x開發(fā)平臺為主線開源Linux,CCS 6.x,各種獨立于操作系統(tǒng)的設(shè)備驅(qū)動程序提供了前所未有的易用性,以及TI-RTOS,支持跨處理器內(nèi)核的無縫任務(wù)管理。該器件還具有先進的調(diào)試和跟蹤技術(shù),以及TI和ARM的最新創(chuàng)新,例如系統(tǒng)跟蹤和ARM CoreSight組件的無縫集成。

安全啟動也可用于反證和非法軟件更新保護。有關(guān)安全啟動的更多信息,請聯(lián)系TI銷售代表。

特性

  • Processor Cores:
  • ARM? Cortex?-A15 Microprocessor Unit (ARM A15) Subsystem at up to 1000 MHz
    • Supports Full Implementation of ARMv7-A Architecture Instruction Set
    • Integrated SIMDv2 (NEON? Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 Program Memory
    • 32KB of L1 Data Memory
    • 512KB of L2 Memory
    • Error Correction Code (ECC) Protection for L1 Data Memory ECC for L2 Memory
    • Parity Protection for L1 Program Memory
    • Global Timebase Counter (GTC)
      • 64-Bit Free-Running Counter That Provides Timebase for ARM A15 InternalTimers
      • Compliant to ARM V7 MPCore Architecture for Generic Timers
  • C66x Fixed- and Floating-Point VLIW DSP Subsystem at up to 1000 MHz
    • Fully Object-Code Compatible With C67x+ and C64x+ Cores
    • 32KB of L1 Program Memory
    • 32KB of L1 Data Memory
    • 1024KB of L2 Configurable as L2 RAM or Cache
    • Error Detection for L1 Program Memory
    • ECC for L1 Data Memory
    • ECC for L2 Data Memory
  • Industrial Subsystem:
  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), Each Supports:
    • Two Programmable Real-Time Units (PRUs) With Enhanced Multiplier and Accumulator, Each PRU Supports:
      • 16KB of Program Memory WithECC
      • 8KB of Data Memory With ECC
      • CRC32 and CRC16 HardwareAccelerator
      • 20 × Enhanced GPIO
      • Serial Capture Unit (SCU),Supporting Direct Connection, 16-bit Parallel Capture, 28-bit Shift, MII_RT, EnDat 2.2 Protocol andSigma-Delta Demodulation
      • Scratch Pad and XFR DirectConnect
    • 64KB of General-Purpose Memory With ECC
    • One Ethernet MII_RT Module with Two MII Ports Configurable for Connection With Each PRU; Support Multiple Industrial Communication Protocols
    • Industrial Ethernet Peripheral (IEP) to Manage and Generate Industrial Ethernet Functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, With a Dedicated 192-MHz Clock to Support 12-Mbps PROFIBUS?
    • Built-In Industrial Ethernet 64-Bit Timer
    • Built-In Enhanced Capture Module (eCAP)
  • Memory Subsystem:
  • Multicore Shared Memory Controller (MSMC) With 1024KB of Shared L2 RAM
    • Provides High-Performance Interconnect to Internal Shared SRAM and DDR EMIF for Both ARM A15 and C66x Access
    • Supports ARM I/O Coherency Where ARM A15 is Cache Coherent to Other System Masters Accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB Memory Address Range
    • Supports 32-Bit SDRAM Data Bus With 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM Data Bus Without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit Asynchronous Memory Interface With up to Four Chip Selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports General-Purpose Memory-Port Expansion With the Following Modes:
      • Asynchronous Read and Write Access
      • Asynchronous ReadPage Access (4-, 8-, 16-Word16)
      • Synchronous Read and WriteAccess
      • Synchronous Read Burst Access Without Wrap Capability (4-, 8-,16-Word16)
  • Network Subsystem (NSS):
  • Ethernet MAC Subsystem (EMAC)
    • One-Port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps Full Duplex
    • Supports 10-, 100-Mbps Half Duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum Frame Size 2016 Bytes (2020 Bytes With VLAN)
    • Eight Priority Level QOS Support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to Facilitate Audio Video Bridging 802.1AS Precision Time Protocol
    • CPTS Module With Timestamping Support for IEEE 1588v2
    • DSCP Priority Mapping (IPv4 and IPv6)
    • MDIO Module for PHY Management
    • Enhanced Statistics Collection
  • Navigator Subsystem (NAVSS)
    • Built-In Packet DMA Controller for Optimized Network Processing
    • Built-In Queue Manager (QM) for Optimized Network Processing
      • Supports up to 128 Queues
      • 2048 Buffers Supported inInternal Queue RAM
  • Crypto Engine (SA) Supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block Data Encryption Supported Through Hardware Cores
      • AES With 128-, 192-, and 256-Bit Key Supports
      • DESand 3DES With 1, 2, or 3 Different Key Support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) With Elliptic Curve Cryptography
    • Elliptic Curve Diffie–Hellman (ECDH) Based Key Exchange and Digital Signature (ECDSA) Applications
    • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
    • Keyed HMAC Operation Through Hardware Core
    • True Random Number Generator (TRNG)
  • Display Subsystem:
  • Supports One Video Pipe With In-Loop Scaling, Color Space
  • Conversion and Background Color Overlay
  • Input Data Format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
  • Supported Display Interfaces:
    • MIPI? DPI 2.0 Parallel Interface
    • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
    • BT.656 4:2:2
    • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
  • In-Loop Scaling Capability
  • LCD Display Interface Supports:
    • Active Matrix (TFT)
    • Passive Matrix (STN)
    • Grayscale
    • TDM
    • AC Bias Control
    • Dither
    • CPR
  • Asynchronous Audio Sample Rate Converter (ASRC)
  • High performance Asynchronous Sample Rate Converter with 140dB Signal-to-Noise (SNR)
  • Up to 8 Stereo Streams (16 Audio Channels)
  • Automatically Sensing / Detection of Input Sample Frequencies
  • Attenuation of Sampling Clock Jitter
  • 16-, 18-, 20-, 24-Bit Data Input/Output
  • Audio Sample Rates from 8 kHz to 216 kHz
  • Input/Output Sampling Ratios from 16:1 to 1:16
  • Group Mode, Where Multiple ASRC Blocks Use the Same Timing Loop for Input or Output
  • Linear Phase FIR Filter
  • Controllable Soft Mute
  • Independent Clock Generator, and Rate and Stamp Generator, for Each Input and Output Clock Zone
  • Separate DMA Events for Input and Output, for Each Channel and Group
  • High-Speed Serial Interfaces:
  • PCI Express? 2.0 Port with Integrated PHY:
    • Single Lane Gen2-Compliant Port
    • Root Complex (RC) and End Point (EP) Modes
  • Up to Two USB 2.0 High-Speed Dual-Role Ports With Integrated PHYs, Support:
    • Dual-role-device (DRD) Capability With:
      • USB 2.0 Peripheral (or Device) at
        HS (480Mbps) and FS (12Mbps) Speeds
      • USB 2.0 Host at HS(480Mbps),
        FS (12Mbps), and LS (1.5Mbps) Speeds
      • USB 2.0 Static Peripheral and Static HostOperations
    • xHCI Controller With the Following Features:
      • Compatible to the xHCI Specification (revision 1.1) in Host Mode
      • All Modes of Transfer (Control, Bulk, Interrupt, andIsochronous)
      • 15 Transmit (TX), 15 Receive (RX) Endpoints (EPs), and OneBidirectional EP0 Endpoint
  • Flash Media Interfaces:
  • QSPI? With XIP and up to Four Chip Selects, Supports:
    • Memory-Mapped Direct Mode of Operation for Performing FLASH Data Transfers and Executing Code From FLASH Memory (XIP)
    • Supports up to 96 MHz
    • Internal SRAM Buffer With ECC
    • High Speed Read Data Capture Mechanism
  • Two Multimedia Card (MMC) and Secure Digital (SD) Ports
    • Supports JEDEC JESD84 v4.5-A441 and SD3.0 Physical Layer With SDA3.00 Standards
    • MMC0 Supports 3.3-V I/O for:
      • SD DS and HS Mode
      • eMMC Mode HS-SDR and DDR
        up to 48 MHz
    • MMC1 Supports 1.8-V I/O Modes for eMMC, Including HS-SDR and DDR at up to 48 MHz With 4- and 8-Bit Bus Width
  • Audio Peripherals:
  • Three Multichannel Audio Serial Port (McASP) Peripherals
    • Transmit and Receive Clocks up to 50 MHz
    • Two Independent Clock Zones and Independent Transmit and Receive Clocks per McASP
    • Up to 16-, 10-, 6-Serial Data Pins for McASP0, McASP1, and McASP2, Respectively
    • Supports TDM, I2S, and Similar Formats
    • Supports DIT Mode
    • Built-In FIFO Buffers for Optimized System Traffic
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 50 MHz
    • Two Clock Zones and Two Serial-Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Automotive Peripherals:
  • Two Controller Area Network (CAN) Ports
    • Supports CAN v2.0 Part A, B (ISO 11898-1) Protocol
    • Bit Rates up to 1 Mbps
    • Dual Clock Source
    • ECC Protection for Message RAM
  • One Media Local Bus (MLB)
    • Supports Both 3-Pin (Up to MOST50, 1024 × Fs) and 6-Pin (Up to MOST150, 2048 × Fs) Versions of MediaLB? Physical Layer Specification v4.2
    • Supports All Types of Data Transfer Over 64 Logical Channels (Synchronous Stream, Isochronous, Asynchronous Packet, Control Message)
    • Supports 3-Wire MOST 150 Protocol
  • Real-Time Control Interfaces:
  • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter Supports:
    • Dedicated 16-Bit Time-Base With Period and Frequency Control
    • Two Independent PWM Outputs With Single Edge Operation
    • Two Independent PWM Outputs With Dual-Edge Symmetric Operation
    • One Independent PWM Output With Dual-Edge Asymmetric Operation
  • Two 32-Bit Enhanced Capture Modules (eCAP):
    • Supports One Capture Input or One Auxiliary PWM Output Configuration Options
    • 4-Event Time-Stamp Registers (Each 32-Bits)
    • Interrupt on Either of the Four Events
  • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), Each Supports:
    • Quadrature Decoding
    • Position Counter and Control Unit for Position Measurement
    • Unit Time Base for Speed and Frequency Measurement
  • General Connectivity:
  • Three Inter-Integrated Circuit (I2C) Interfaces, Each Supports:
    • Standard (up to 100 kHz) and
      Fast (up to 400 kHz) Modes
    • 7-Bit Addressing Mode
    • Supports EEPROM Size Up to 4Mbit
  • Four Serial Peripheral Interfaces (SPI), Each Supports:
    • Operates at up to 50 MHz in Master Mode and 25 MHz in Slave Mode
    • Two Chip Selects
  • Three UART Interfaces
    • All UARTs are 16C750-Compatible and Operate at Up to 3M Baud
    • UART0 Supports 8 Pins With Full Modem Control, With DSR, DTR, DCD, and RI Signals
    • UART1 and UART2 are 4-Pin Interfaces
  • General-Purpose I/O (GPIO)
    • Up to 212 GPIOs Muxed With Other Interfaces
    • Can be Configured as Interrupt Pins
  • Timers and Miscellaneous Modules:
  • Seven 64-Bit Timers:
    • Two 64-Bit Timers Dedicated to ARM A15 and DSP Cores (One Timer per Core)
      • Watchdog and General-Purpose (GP)
    • Four 64-Bit Timers are Shared for General Purposes
    • Each 64-Bit Timer Can be Configured as Two Individual 32-Bit Timers
    • One 64-Bit Timer Dedicated for PMMC
    • Two Timers Input/Output Pin Pairs
  • Interprocessor Communication With:
    • Message Manager to Facilitate Multiprocessor Access to the PMMC:
      • Provides Hardware Acceleration for Pushing and Popping Messages to/fromLogical Queues
      • Supports Up to 64 Queues and 128 Messages
    • Semaphore Module With Up to 64 Independent Semaphores and 16 Masters (device cores)
  • EDMA With 128 (2 × 64) Channels and
    1024 (2 × 512) PaRAM Entries
  • Keystone II System on Chip (SoC) Architecture:
  • Security
    • Supports General-Purpose (GP) and High-Secure (HS) Devices
    • Supports Secure Boot
    • Supports Customer Secondary Keys
    • 4KB of One-Time Programmable (OTP) ROM for Customer Keys
  • Power Management
    • Integrated Power Management Microcontroller (PMMC) Technology
  • Supports Primary Boot From UART, I2C, SPI, GPMC, SD or eMMC, USB Device Firmware Upgrade v1.1, PCIe?, and Ethernet Interfaces
  • Keystone II Debug Architecture With Integrated ARM CoreSight? Support and Trace Capability
  • Operating Temperature (TJ):
  • –40°C to 125°C (Automotive)
  • –40°C to 105°C (Extended)
  • 0°C to 90°C (Commercial)

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參數(shù) 與其它產(chǎn)品相比?66AK2x

?
Applications
Operating Systems
Arm CPU
Arm MHz (Max.)
DSP
DSP MHz (Max)
Hardware Accelerators
Other On-Chip Memory
DRAM
EMAC
JESD204B
Memory
Operating Temperature Range (C)
PCI/PCIe
On-Chip L2 Cache/RAM
USB
SPI
I2C
UART (SCI)
66AK2G12
Communications and Telecom
Consumer Electronics
Industrial
Test and Measurement ? ?
Linux
TI-RTOS ? ?
1 ARM Cortex-A15 ? ?
1000 ? ?
1 C66x ? ?
1000 ? ?
PRU-ICSS
Security Accelerator ? ?
1024KB w/ECC ? ?
DDR3L ? ?
1-port 1Gb
4-port 10/100 PRU EMAC ? ?
0 ? ?
ECC ? ?
0 to 70 ? ?
PCIe Gen2 ? ?
512KB w/ECC ARM Cortex-A15
1024KB w/ECC C66x DSP ? ?
2 ? ?
4 ? ?
3 ? ?
3 ? ?

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