優勢和特點
- Application-tuned peripherals provide glueless connectivity to general-purpose converters in data acquisition applications
| - Large on-chip SRAM for maximum system performance
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產品詳情
The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin? embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer,communications, automotive, and industrial/instrumentation.
Architectural Features- High performance 16-bit/32-bit embedded processor core
- 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
- Full SIMD architecture, including instructions for accelerated video and image processing
- Memory management unit (MMU) supporting full memory protection for an isolated and secure environment
High Level of Integration- Up to 148 kB of on-chip SRAM
- Glueless video capture and display port
- Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
- 12 DMA channels supporting one- and two-dimensional data transfers
- Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
- 160-ball mini-BGA, 169-ball PBGA packages
- Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available
方框圖
工商網監
湘ICP備2023018690號-1
