芯片集成度的提高，要受到因電子元器件發(fā)熱而引起的熱障所限制。近年來，隨著微，納電子技術(shù)的飛速發(fā)展，更使得對高性能冷卻技術(shù)的需求提到了前所未有的層面。對此的全力追求，促成了一系列激動人心的新型冷卻方法的建立。在討論電子元器件產(chǎn)熱機(jī)制的基礎(chǔ)上，對新近涌現(xiàn)出的若干典型芯片冷卻技術(shù)及其應(yīng)用情況進(jìn)行了綜合分析，討論了其優(yōu)缺點(diǎn)及有待解決的關(guān)鍵問題，并對這一領(lǐng)域的發(fā)展前景作了一定展望。
關(guān)鍵詞熱工學(xué)；芯片冷卻技術(shù)；綜述；芯片封裝；強(qiáng)化換熱；氣冷；液冷；固體制冷
Latest Res earch Advancement and Assessment of Chip Cooling Techniques
Li Tena and Liu Jing Technical Institute of Physics and Chemistry，Chinese Academy of Sciences，Beijing 100080 Abstract Improvement on the chip integration density has to face the restriction fr(>m the thermal barrier caused by the heat generation within the electronic elements．Recently，with the rapid progress of the micro／nano electronics，requirement on high perform ance chip cooling techniques has been further placed at a new high leve1．Eforts made towards this direction have led to the establishment of a series of new exciting methods．Based on anatyzing the heat ge neration mechanisms of the electronic elements，the newly emerging chip cooling tec hniques and their practical applications are reviewed ．Advantages and shortcomings of these methods and the relative critical issues are evaluated ．Prospect in the chip cooling area is also stated ．
Keywords Pyrolog y；chip cooling technique；review；chip package；enhanced heat transfer；gas cooling；liquid cooling；so lid refrigeration